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Advanced materials for thermal manag...
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SpringerLink (Online service)
Advanced materials for thermal management of electronic packaging
Record Type:
Electronic resources : Monograph/item
Title/Author:
Advanced materials for thermal management of electronic packaging/ by Xingcun Colin Tong.
Author:
Tong, Xingcun Colin.
Published:
New York, NY :Springer Springer Science+Business Media, LLC, : 2011.,
Description:
xxi, 606 p. :ill. (some col.), digital ; : 24 cm.;
Series:
Springer series in advanced microelectronics,
Contained By:
Springer eBooks
Subject:
Engineering Thermodynamics, Heat and Mass Transfer. -
Online resource:
http://dx.doi.org/10.1007/978-1-4419-7759-5
ISBN:
9781441977595 (electronic bk.)
Advanced materials for thermal management of electronic packaging
Tong, Xingcun Colin.
Advanced materials for thermal management of electronic packaging
[electronic resource] /by Xingcun Colin Tong. - New York, NY :Springer Springer Science+Business Media, LLC,2011. - xxi, 606 p. :ill. (some col.), digital ;24 cm. - Springer series in advanced microelectronics,301437-0387 ;.
ISBN: 9781441977595 (electronic bk.)Subjects--Topical Terms:
240551
Engineering Thermodynamics, Heat and Mass Transfer.
LC Class. No.: TK7870.15 / .T66 2011
Dewey Class. No.: 621.381046
Advanced materials for thermal management of electronic packaging
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by Xingcun Colin Tong.
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2011.
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Engineering (Springer-11647)
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