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Moisture sensitivity of plastic pack...
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Fan, X.J.
Moisture sensitivity of plastic packages of IC devices
Record Type:
Electronic resources : Monograph/item
Title/Author:
Moisture sensitivity of plastic packages of IC devices/ edited by X.J. Fan, E. Suhir.
other author:
Suhir, E.
Published:
Boston, MA :Springer Science+Business Media, LLC, : 2010.,
Description:
xvii, 570 p. :ill., digital ; : 24 cm.;
Series:
Micro- and Opto-Electronic Materials, Structures, and Systems
Contained By:
Springer eBooks
Subject:
Engineering. -
Online resource:
http://dx.doi.org/10.1007/978-1-4419-5719-1
ISBN:
9781441957191 (electronic bk.)
Moisture sensitivity of plastic packages of IC devices
Moisture sensitivity of plastic packages of IC devices
[electronic resource] /edited by X.J. Fan, E. Suhir. - Boston, MA :Springer Science+Business Media, LLC,2010. - xvii, 570 p. :ill., digital ;24 cm. - Micro- and Opto-Electronic Materials, Structures, and Systems.
ISBN: 9781441957191 (electronic bk.)Subjects--Topical Terms:
120442
Engineering.
LC Class. No.: TK7870.15 / .M65 2010
Dewey Class. No.: 621.381046
Moisture sensitivity of plastic packages of IC devices
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edited by X.J. Fan, E. Suhir.
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Boston, MA :
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2010.
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Springer Science+Business Media, LLC,
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xvii, 570 p. :
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ill., digital ;
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24 cm.
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Micro- and Opto-Electronic Materials, Structures, and Systems
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Engineering.
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Plastics in packaging
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Moisture.
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Electronic packaging
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Suhir, E.
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Fan, X.J.
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http://dx.doi.org/10.1007/978-1-4419-5719-1
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Engineering (Springer-11647)
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