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Mayer, Michael.

Overview

Works:	1 works in 1 publications in 1 languages

Titles

Force Sensors for Microelectronic Packaging Applications by: Brand, Oliver.; SpringerLink (Online service); Mayer, Michael.; Schwizer, Jurg. (Electronic resources)

Subjects

Electronics and Microelectronics, Instrumentation. Quality Control, Reliability, Safety and Risk. Physics and Applied Physics in Engineering. Optical and Electronic Materials. Wire bonding (Electronic packaging) Nanotechnology. Chemistry. Microelectronic packaging.

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