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Tong, Xingcun Colin.

Overview

Works:	3 works in 1 publications in 1 languages

Titles

Advanced materials for thermal management of electronic packaging by: SpringerLink (Online service); Tong, Xingcun Colin. (Electronic resources)

Subjects

Electronics and Microelectronics, Instrumentation. Electronic Circuits and Devices. Materials. Engineering Thermodynamics, Heat and Mass Transfer. Physics. Electronic packaging. Optical and Electronic Materials.

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