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Sitaraman, Suresh K.

Overview

Works:	1 works in 1 publications in 1 languages

Titles

Solder joint reliability prediction for multiple environments by: Perkins, Andrew E.; SpringerLink (Online service); Sitaraman, Suresh K. (Electronic resources)

Subjects

Electronics and Microelectronics, Instrumentation. Joints (Engineering)- Reliability. Solder and soldering. Quality Control, Reliability, Safety and Risk. Optical and Electronic Materials. Metallic Materials. Electronic apparatus and appliances- Reliability. Engineering.

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