新生學校財團法人新生醫護管理專科學校圖書館 |

Handbook of thin-film deposition processes and techniques = principles, methods, equipment and applications /

Record Type:	Electronic resources : Monograph/item
Title/Author:	Handbook of thin-film deposition processes and techniques/ edited by Krishna Seshan.
Reminder of title:	principles, methods, equipment and applications /
other author:	Seshan, Krishna.
Published:	Norwich, N.Y. :Noyes Publications/William Andrew Pub., : c2002.,
Description:	1 online resource (xxviii, 629 p.) :ill. :
Subject:	Thin film devices - Handbooks, manuals, etc. - Design and construction -
Online resource:	http://www.sciencedirect.com/science/book/9780815514428
ISBN:	1591241936 (electronic bk.)

Handbook of thin-film deposition processes and techniques = principles, methods, equipment and applications /
Handbook of thin-film deposition processes and techniquesprinciples, methods, equipment and applications /[electronic resource] :edited by Krishna Seshan. - 2nd ed. - Norwich, N.Y. :Noyes Publications/William Andrew Pub.,c2002. - 1 online resource (xxviii, 629 p.) :ill. - Materials science and process technology series. Electronic materials and process technology. - Materials science and process technology series.Electronic materials and process technology..

Includes bibliographical references and index.

Foreword: Gordon Moore -- Recent Changes in the Semiconductor Industry -- Deposition Technologies and Applications: Introduction and Overview -- Silicon Epitaxy by Chemical Vapor Deposition -- Chemical Vapor Deposition of Silicon Dioxide Films -- Metal Organic Chemical Vapor Deposition -- Feature Scale Modeling -- The Role of Metrology and Inspection to Semiconductor Processing -- Contamination Control, Defect Detection and Yield Enhancement in Gigabit Manufacturing -- Sputtering and Sputter Deposition -- Laser and Electron Beam Assisted Processing -- Molecular Beam Epitaxy: Equipment and Practice -- Ion Beam Deposition -- Chemical Mechanical Polishing -- Organic Dielectrics in Multilevel Metallization of Integrated Circuits -- Performance, Processing, and Lithography Trends -- Index.

The 2nd edition contains new chapters on contamination and contamination control that describe the basics and the issues. Another new chapter on meteorology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together physical vapor deposition techniques. Two entirely new areas are focused on: chemical mechanical polishing, which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.

ISBN: 1591241936 (electronic bk.)

Source: 153812:153972Elsevier Science & Technologyhttp://www.sciencedirect.comSubjects--Topical Terms:

257131
Thin film devices
--Design and construction--Handbooks, manuals, etc.Index Terms--Genre/Form:

96803
Electronic books.

LC Class. No.: TK7872.T55 / H36 2002eb

Dewey Class. No.: 621.3815/2

Handbook of thin-film deposition processes and techniques = principles, methods, equipment and applications /
LDR:03647cmm 2200493La 4500 001 139626
005 20120813083451.0
006 m d
007 cr un|||||||||
008 160121s2002 nyua obf 001 0 eng d
019 $a 49411049 $a 271043837 $a 281603397 $a 303292812 $a 471136041 $a 505118548 $a 647800831
020 $a 1591241936 (electronic bk.)
020 $a 9781591241935 (electronic bk.)
020 $a 9780815517788 (electronic bk.)
020 $a 0815517785 (electronic bk.)
020 $a 9780815514428
020 $a 0815514425
020 $a 9780815517764 (electronic bk.)
020 $a 0815517769 (electronic bk.)
029 1 $a NZ1 $b 10240380
029 1 $a AU@ $b 000025337205
029 1 $a AU@ $b 000027051712
029 1 $a DEBBG $b BV039828143
035 $a ocm49708503
037 $a 153812:153972 $b Elsevier Science & Technology $n http://www.sciencedirect.com
040 $a KNOVL $b eng $c KNOVL $d OCLCQ $d TEF $d OCLCQ $d SHH $d OCLCQ $d VLB $d OPELS $d N $d YDXCP $d UBY $d UWW $d IDEBK $d AU@ $d E7B $d QE2 $d B24X7
049 $a NTYA
050 4 $a TK7872.T55 $b H36 2002eb
072 7 $a TEC $x 008100 $2 bisacsh
072 7 $a TEC $x 008090 $2 bisacsh
082 0 4 $a 621.3815/2 $2 22
245 0 0 $a Handbook of thin-film deposition processes and techniques $h [electronic resource] : $b principles, methods, equipment and applications / $c edited by Krishna Seshan.
250 $a 2nd ed.
260 $a Norwich, N.Y. : $c c2002. $b Noyes Publications/William Andrew Pub.,
300 $a 1 online resource (xxviii, 629 p.) : $b ill.
490 1 $a Materials science and process technology series. Electronic materials and process technology
504 $a Includes bibliographical references and index.
505 0 $a Foreword: Gordon Moore -- Recent Changes in the Semiconductor Industry -- Deposition Technologies and Applications: Introduction and Overview -- Silicon Epitaxy by Chemical Vapor Deposition -- Chemical Vapor Deposition of Silicon Dioxide Films -- Metal Organic Chemical Vapor Deposition -- Feature Scale Modeling -- The Role of Metrology and Inspection to Semiconductor Processing -- Contamination Control, Defect Detection and Yield Enhancement in Gigabit Manufacturing -- Sputtering and Sputter Deposition -- Laser and Electron Beam Assisted Processing -- Molecular Beam Epitaxy: Equipment and Practice -- Ion Beam Deposition -- Chemical Mechanical Polishing -- Organic Dielectrics in Multilevel Metallization of Integrated Circuits -- Performance, Processing, and Lithography Trends -- Index.
520 $a The 2nd edition contains new chapters on contamination and contamination control that describe the basics and the issues. Another new chapter on meteorology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together physical vapor deposition techniques. Two entirely new areas are focused on: chemical mechanical polishing, which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
588 $a Description based on print version record.
650 0 $a Thin film devices $x Design and construction $v Handbooks, manuals, etc. $3 257131
650 0 $a Thin films $v Handbooks, manuals, etc. $3 229359
650 0 $a Chemical vapor deposition $v Handbooks, manuals, etc. $3 257132
650 7 $a Filmes finos (equipamentos) $2 larpcal $3 257133
650 7 $a TECHNOLOGY & ENGINEERING $x Electronics $x Solid State. $2 bisacsh $3 257134
650 7 $a TECHNOLOGY & ENGINEERING $x Electronics $x Semiconductors. $2 bisacsh $3 257135
655 4 $a Electronic books. $2 local. $3 96803
700 1 $a Seshan, Krishna. $3 229211
776 0 8 $i Print version: $t Handbook of thin-film deposition processes and techniques : principles, methods, equipment and applications. $d Norwich, N.Y. : Noyes Publications/William Andrew Pub., 2002 $z 0815514425 $w (DLC) 2001135178 $w (OCoLC)42960492
830 0 $a Materials science and process technology series. $p Electronic materials and process technology. $3 257130
856 4 0 $3 ScienceDirect $u http://www.sciencedirect.com/science/book/9780815514428
938 $a YBP Library Services $b YANK $n 2965173
938 $a ebrary $b EBRY $n ebr10305203
938 $a Books 24x7 $b B247 $n bke00032256