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Advanced MEMS packaging
~
Lau, John H.
Advanced MEMS packaging
紀錄類型:
書目-電子資源 : 單行本
正題名/作者:
Advanced MEMS packaging/ John H. Lau ... [et al.].
其他題名:
Advanced microelectromechanical systems packaging.
其他作者:
Lau, John H.
出版者:
New York :McGraw-Hill, : c2010.,
面頁冊數:
xxiii, 552 p. :ill. :
標題:
Microelectromechanical systems. -
電子資源:
Click for full text (McGrawHill)
ISBN:
9780071626231
Advanced MEMS packaging
Advanced MEMS packaging
[electronic resource] /Advanced microelectromechanical systems packaging.John H. Lau ... [et al.]. - New York :McGraw-Hill,c2010. - xxiii, 552 p. :ill.
Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices.
ISBN: 9780071626231
LCCN: 2009040456Subjects--Topical Terms:
120799
Microelectromechanical systems.
Index Terms--Genre/Form:
96803
Electronic books.
LC Class. No.: TK7875 / .A378 2010
Dewey Class. No.: 621.381/046
Advanced MEMS packaging
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Click for full text (McGrawHill)
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