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Advanced materials for thermal manag...
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Advanced materials for thermal management of electronic packaging
紀錄類型:
書目-電子資源 : 單行本
正題名/作者:
Advanced materials for thermal management of electronic packaging/ by Xingcun Colin Tong.
作者:
Tong, Xingcun Colin.
出版者:
New York, NY :Springer Springer Science+Business Media, LLC, : 2011.,
面頁冊數:
xxi, 606 p. :ill. (some col.), digital ; : 24 cm.;
叢書名:
Springer series in advanced microelectronics,
Contained By:
Springer eBooks
標題:
Engineering Thermodynamics, Heat and Mass Transfer. -
電子資源:
http://dx.doi.org/10.1007/978-1-4419-7759-5
ISBN:
9781441977595 (electronic bk.)
Advanced materials for thermal management of electronic packaging
Tong, Xingcun Colin.
Advanced materials for thermal management of electronic packaging
[electronic resource] /by Xingcun Colin Tong. - New York, NY :Springer Springer Science+Business Media, LLC,2011. - xxi, 606 p. :ill. (some col.), digital ;24 cm. - Springer series in advanced microelectronics,301437-0387 ;.
ISBN: 9781441977595 (electronic bk.)Subjects--Topical Terms:
240551
Engineering Thermodynamics, Heat and Mass Transfer.
LC Class. No.: TK7870.15 / .T66 2011
Dewey Class. No.: 621.381046
Advanced materials for thermal management of electronic packaging
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