新生學校財團法人新生醫護管理專科學校圖書館 |

Handbook of silicon based MEMS = materials & technologies /

Record Type:	Electronic resources : Monograph/item
Title/Author:	Handbook of silicon based MEMS/ by Veikko Lindroos ... [et al.].
Reminder of title:	materials & technologies /
other author:	Lindroos, Veikko.
Published:	Norwich, N.Y. :William Andrew ; : 2010.,
Description:	1 online resource.
Subject:	Microelectromechanical systems. -
Online resource:	http://www.sciencedirect.com/science/book/9780815515944
ISBN:	9780815515944

Handbook of silicon based MEMS = materials & technologies /
Handbook of silicon based MEMSmaterials & technologies /[electronic resource] :by Veikko Lindroos ... [et al.]. - Norwich, N.Y. :William Andrew ;2010. - 1 online resource.

Silicon as MEMS Material -- Modeling in MEMS -- Measuring MEMS -- Micromachining Technologies in MEMS -- Encapsulation of MEMS Components.

A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: Silicon as MEMS material Material properties and measurement techniques Analytical methods used in materials characterization Modeling in MEMS Measuring MEMS Micromachining technologies in MEMS Encapsulation of MEMS components Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R & D and academic communities. Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. . Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques . Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs . Discusses properties, preparation, and growth of silicon crystals and wafers . Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures.

ISBN: 9780815515944

Source: 154067:154227Elsevier Science & Technologyhttp://www.sciencedirect.comSubjects--Topical Terms:

120799
Microelectromechanical systems.
Index Terms--Genre/Form:

96803
Electronic books.

LC Class. No.: TK7872 / .H36 2010

Dewey Class. No.: 621.38152

Handbook of silicon based MEMS = materials & technologies /
LDR:03131cmm 2200313Ia 4500 001 166591
003 OCoLC
005 20111122090956.0
006 m d
007 cr cn|||||||||
008 160302s2010 nyu o 000 0 eng d
020 $a 9780815515944
020 $a 0815515944
029 1 $a AU@ $b 000045964063
035 $a (OCoLC)528581495
035 $a ocn528581495
037 $a 154067:154227 $b Elsevier Science & Technology $n http://www.sciencedirect.com
040 $a OPELS $b eng $c OPELS $d OPELS $d OCLCQ
049 $a TEFA
050 4 $a TK7872 $b .H36 2010
082 0 4 $a 621.38152 $2 22
245 0 0 $a Handbook of silicon based MEMS $h [electronic resource] : $b materials & technologies / $c by Veikko Lindroos ... [et al.].
260 $a Norwich, N.Y. : $a Oxford : $c 2010. $b William Andrew ; $b Elsevier Science [distributor],
300 $a 1 online resource.
505 0 $a Silicon as MEMS Material -- Modeling in MEMS -- Measuring MEMS -- Micromachining Technologies in MEMS -- Encapsulation of MEMS Components.
520 $a A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: Silicon as MEMS material Material properties and measurement techniques Analytical methods used in materials characterization Modeling in MEMS Measuring MEMS Micromachining technologies in MEMS Encapsulation of MEMS components Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R & D and academic communities. Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. . Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques . Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs . Discusses properties, preparation, and growth of silicon crystals and wafers . Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures.
588 $a Description based on print version record.
650 0 $a Microelectromechanical systems. $3 120799
650 0 $a Microelectromechanical systems $x Materials. $3 316288
650 0 $a Silicon $x Electric properties. $3 122431
655 4 $a Electronic books. $2 local. $3 96803
700 1 $a Lindroos, Veikko. $3 324025
776 0 8 $i Print version: $t Handbook of silicon based MEMS. $d Norwich, N.Y. : William Andrew ; Oxford : Elsevier Science [distributor], 2010 $z 9780815515944 $z 0815515944 $w (OCoLC)428777214
856 4 0 $3 ScienceDirect $u http://www.sciencedirect.com/science/book/9780815515944
994 $a C0 $b TEF