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Solder joint reliability prediction ...
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Perkins, Andrew E.
Solder joint reliability prediction for multiple environments
Record Type:
Electronic resources : Monograph/item
Title/Author:
Solder joint reliability prediction for multiple environments/ by Andrew E. Perkins, Suresh K. Sitaraman.
Author:
Perkins, Andrew E.
other author:
Sitaraman, Suresh K.
Published:
Boston, MA :Springer Science+Business Media, LLC, : 2009.,
Description:
xv, 192 p. :ill., digital ; : 24 cm.;
Contained By:
Springer eBooks
Subject:
Solder and soldering. -
Online resource:
http://dx.doi.org/10.1007/978-0-387-79394-8
ISBN:
9780387793948 (electronic bk.)
Solder joint reliability prediction for multiple environments
Perkins, Andrew E.
Solder joint reliability prediction for multiple environments
[electronic resource] /by Andrew E. Perkins, Suresh K. Sitaraman. - Boston, MA :Springer Science+Business Media, LLC,2009. - xv, 192 p. :ill., digital ;24 cm.
ISBN: 9780387793948 (electronic bk.)Subjects--Topical Terms:
241175
Solder and soldering.
LC Class. No.: TK7870.15 / .P47 2009
Dewey Class. No.: 621.381046
Solder joint reliability prediction for multiple environments
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[electronic resource] /
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by Andrew E. Perkins, Suresh K. Sitaraman.
260
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Boston, MA :
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2009.
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Springer Science+Business Media, LLC,
300
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xv, 192 p. :
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ill., digital ;
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24 cm.
650
0
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Solder and soldering.
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241175
650
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Joints (Engineering)
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Reliability.
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377040
650
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Electronic apparatus and appliances
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Reliability.
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Quality Control, Reliability, Safety and Risk.
$3
121187
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2 4
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Optical and Electronic Materials.
$3
120414
650
2 4
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Metallic Materials.
$3
120899
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2 4
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Electronics and Microelectronics, Instrumentation.
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Engineering.
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120442
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Sitaraman, Suresh K.
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http://dx.doi.org/10.1007/978-0-387-79394-8
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Engineering (Springer-11647)
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