Microelectronic packaging.

Force Sensors for Microelectronic Packaging Applications by: (Electronic resources)

Hot Cracking Phenomena in Welds by: (Electronic resources)

Advanced MEMS packaging by: (Electronic resources)

RF and Microwave Microelectronics Packaging by: (Electronic resources)

Bio and nano packaging techniques for electron devices = advances in electronic device packaging / by: (Electronic resources)

Electronics and Microelectronics, Instrumentation.

Engineering

Physics and Applied Physics in Engineering.

Optical and Electronic Materials.

Microelectronic packaging.

Microwaves, RF and Optical Engineering

Circuits and Systems

Materials Science.

Quality Control, Reliability, Safety and Risk.

Wire bonding (Electronic packaging)

Nanotechnology.

Chemistry.

Continuum Mechanics and Mechanics of Materials.

Metallic Materials.

Characterization and Evaluation of Materials.

Microelectromechanical systems.

Electronics and Microelectronics, Instrumentation