Microelectronic packaging.

Force Sensors for Microelectronic Packaging Applications by: (書目-電子資源)

Hot Cracking Phenomena in Welds by: (書目-電子資源)

Advanced MEMS packaging by: (書目-電子資源)

RF and Microwave Microelectronics Packaging by: (書目-電子資源)

Bio and nano packaging techniques for electron devices = advances in electronic device packaging / by: (書目-電子資源)

Electronics and Microelectronics, Instrumentation.

Engineering

Physics and Applied Physics in Engineering.

Optical and Electronic Materials.

Microelectronic packaging.

Microwaves, RF and Optical Engineering

Circuits and Systems

Materials Science.

Quality Control, Reliability, Safety and Risk.

Wire bonding (Electronic packaging)

Nanotechnology.

Chemistry.

Continuum Mechanics and Mechanics of Materials.

Metallic Materials.

Characterization and Evaluation of Materials.

Microelectromechanical systems.

Electronics and Microelectronics, Instrumentation